| Application Processor |
NXP i.MX6Solo/DualLite/Dual/Quad with up to four Cortex-A9 cores
Industrial (800/850 MHz), Commercial (1/1.2 GHz) i.MX6 variants
32 KB I-Cache/32 KB D-Cache, up to 1 MB L2-Cache |
| Memory |
Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit) |
| PMIC |
Dialog DA9063 |
| Graphics |
Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging |
| Security |
RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP) |
| Peripherals/Interfaces |
MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, ESAI, I2S/SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG |
| External Bus |
26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes) |
| Ethernet |
1 Gbit Ethernet + IEEE 1588 (MII10, MII100, RMII, RGMII) |
| Wi-Fi |
802.11a/b/g/n:
2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm)
HT40, MCS 0-7
Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2 enterprise, 802.11i, access point mode (up to 10 clients), Wi-Fi Direct
Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready |
| Bluetooth |
Profiles: GAP, SPP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP |
| On-Module Microcontroller Assist |
Kinetis L: MKL14Z32VFT4, MKL14Z64VFT4, MKL15Z128VFT4, MKL15Z32VFT4, MKL15Z64VFT4, MKL24Z32VFT4, MKL24Z64VFT4,
MKL25Z128VFT4, MKL25Z32VFT4, MKL25Z64VFT4, MKL26Z128VFT4, MKL26Z64VFT4, MKL26Z32VFT4
Kinetis K: K10P48M50SF0, K20P48M50SF0
Internal interconnect to i.MX6 via SPI, Kinetis interfaces available on module pads |
| Operating Temperature (Tj) |
Industrial: -40° C to 85° C (-40° F to 185° F) / Commercial: 0° C to 70 C° (32° F to 158° F); depending on use case and enclosure/system design |
| Storage Temperature |
-50° C to 125° C (-58° F to 257° F) |
| Relative Humidity |
Relative Humidity 5% to 90% (non-condensing) |
| Radio Approvals |
US, Canada, EU, Japan, Australia/New Zealand |
| Emissions / Immunity / Safety |
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent) |
| Design Verification |
Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
| Mechanical Dimensions |
LGA-400, 2 mm pitch, fully shielded (heat-spreading) |
| Product Warranty |
3-year |