| Processor |
| Processor Model |
NXP®/Freescale® i.MX535/i.MX537 |
| Speed Grades |
1000/800 MHz |
| Core Type |
ARM® Cortex®-A8 |
| Cache Memory |
32k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified) |
| Internal RAM |
128 KB (secure/non-secure) |
| Vector Floating Point |
• |
| NEON Media Acceleration |
• |
| Memory |
| Flash |
Up to 8 GB NAND flash |
| RAM |
Up to 2 GB DDR2 |
| Debug |
| Secure JTAG |
• |
| ETM/ETB |
• |
| Power Management |
| Power Modes |
Run, Wait, Stop, Low-power screen refresh |
| Wake-up Events |
GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach |
| Dynamic Voltage and Frequency Scaling |
• |
| Backlight Drivers |
3 |
| Battery Management |
• |
| Real Time Clock |
| Battery Backup (External) |
• |
| Security |
| Hardware encryption/decryption |
AES, DES/3DES, RC4, C2
RSA, ECC
MD5, SHA-1/224/256 |
| Random Number Generator |
• |
| Run Time Integrity Checker |
• |
| Secure RAM (internal) |
• |
| Fuse Box (e-Fuses) |
64 Bits (application-specific use) |
| Physical Tamper Detectors |
• |
| Timers |
| General Purpose Timer |
32-bit up-counter with clock source selection
2 input capture channels
3 output compare channels, forced compare |
| Enhanced Periodic Interrupt Timer |
32-bit down-counter with clock source selection
Set-and-forget/free-running modes
Precision interrupt generation |
| Watchdog |
• |
| Thermal Management |
| Temperature Monitor |
On-chip sensor, precision 0 to 135°C ±5°C
Software support for thermal-aware Dyamic Frequency and Voltage Scaling (DFVS) |
| Connectivity |
| UART |
Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support |
| IrDA Infrared |
Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps) |
| CAN |
Up to 2 channels, up to 1 Mbps each, CAN 2.0b (available on i.MX537 variant) |
| CSPI |
Master and slave mode
Bit rate up to 25 Mbps (master) |
| eCSPI |
Up to 2 eCSPI channels, master and slave mode, bit rates up to 52 Mbps |
| I2C |
Up to 2 eCSPI channels, master and slave mode
Bit rates up to 66.5 Mbps (master) |
| SD/SDIO/MMC/eMMC |
Up to 4 ports, 1-/4-/8-bit modes
MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode)
eMMC 4.4: Ultra high speed, up to 832 Mbps |
| I2C |
Up to 3 channels, master/slave (7-/10-bit addressing)
All: Standard (100 kbps) and fast (400 kbps) mode |
| P-ATA |
Up to 66 MB/s data rate
PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5) |
| SATA |
SATA II, up to 1.5 Gbps |
| USB 2.0 High-Speed |
Up to 3 USB 2.0 High-Speed Host ports (one with integrated PHY)
Up to 1 USB 2.0 OTG port with integrated PHY |
| Media Local Bus (MLB) |
MOST (Media Oriented Systems Transport) interface, up to 50 Mbps
|
| 1-Wire |
• |
| ISO 7816 (SIM/Smart Card) |
• |
| Keypad |
8x8 keypad matrix |
| PWM |
2 |
| ADC (10-bit) |
Up to 4 channels |
| GPIO |
Up to 128 GPIOs |
| External Memory Bus |
16-bit data/28-bit address in non-multiplexed address/data mode
16-bit or 32-bit data/28-bit address in multiplexed address/data mode |
| Multimedia |
| Camera |
Two parallel camera ports, up to 20-bit, up to 120 MHz peak
|
| Display |
5 interfaces available - with total rate of all interfaces up to 180 Mpixels/sec, 24 bpp
Up to 2 displays can be driven simultaneously (screen refresh)
Concurrent asynchronous access to 2 additional devices, e.g. display controllers and smart displays
Parallel: 2 24-bit display ports, up to 165 Mpixels/sec, e.g. UXGA @ 60 Hz
LVDS: 1 port up to 165 Mpixels/sec or 2 ports up to 85 Mpixels/sec, e.g. WXGA @ 60 Hz
1 TV-out/VGA port, up to 150 Mpixels/sec, e.g. 1080p60
|
| Image Processing Unit |
Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction |
| Video Processing Unit |
MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG
1080p30 decode, 720p30 encode |
| GPU (2D/3D) |
33 million triangles/sec, 200 million pixels/sec raw
OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0 |
| Touchscreen Interface (4-wire) |
• |
| SPDIF (Tx) |
• |
| I2S/AC97/SSI |
Up to 3 channels |
| ESAI |
Multi-channel digitial audio, up to 1.4 Mbps each channel
|
| ASRC |
• |
| Ethernet |
| Physical Layer |
10/100Base-T |
| Data Rates |
10/100 Mbps, auto-sensing |
| Duplex Mode |
Full or half duplex, auto-sensing |
| IEEE 1588 |
Yes, primary interface only (available on i.MX537 variant) |
| Power over Ethernet (802.3af) |
| Power Over Ethernet |
Development board ready for 802.3af PoE application kit (sold separately) |
| Accelerometer |
| Three-Axis Accelerometer |
±2g/±4g/±8g Three-Axis Low-g
(Freescale MMA7455L) |
| Wireless LAN |
| Standard |
N/A |
802.11a/b/g/n (2.4/5 GHz) |
| Antenna Connectors |
N/A |
2 x U.FL |
| Dual Diversity (Receive) |
N/A |
• |
| Frequency Bands |
N/A |
2.412 - 2.484 GHz
4.900 - 5.850 GHz |
| Data Rates |
N/A |
802.11b: 1, 2, 5.5, 11 Mbps
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 (MCS 0-7) |
| Modulation |
N/A |
DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM |
| 802.11n Features |
N/A |
A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS |
| Transmit Power (±2 dBm) |
N/A |
802.11b: 17 dBm typical
802.11g/n: 15 dBm typical
802.11a: 12 dBm typical |
| Security |
N/A |
WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i |
| QoS |
N/A |
WMM, WMM-PS, 802.11e |
| Roaming Enhancements |
N/A |
802.11k/r |
| Extended Range (802.11n) |
N/A |
• |
| Radio Certifcations |
N/A |
USA, Canada, EU, Japan |
| Power Requirements1 |
| Typical/Idle |
700 mA @ 3.75 V / 200 mA @ 3.75 V |
| Mechanical |
| Dimensions (L x W x H) |
82 mm x 50 mm x 6.5 mm |
82 mm x 50 mm x 8 mm |
| Module Connectors |
2 x 180-pin board-to-board connectors
(Mating connector FCI P/N 61083-184409LF or similar) |
| Environmental |
| Operating Temperature |
-40°C to +85°C (i.MX537, 800 MHz)
-20°C to +70°C (i.MX535, 1000 MHz) |
| Storage Temperature |
-40° C up to +85° C (-40° F to +185° F) |
| Relative Humidity |
5% to 90% (non-condensing) |
| Temperature / Climate Tests |
IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40°C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85°C), IEC 60068-2-78 (Damp heat steady state: 16h with +40°C and 93%rH) |
| Vibration / Shock Tests |
IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea |
| Regulatory Approvals |
| FCC Part 15 Class B |
• |
| FCC Part 15 Sub C Section 15.247 |
• |
| IC RSS-210 Issue 5 Section 6.2.2(o) |
• |
| EN55022:2006 Class B |
• |
| ICES-003, Class B |
• |
| VCCI, Class B |
• |
| EN55024:1998 +A1:2001, A2:2003 |
• |
| EN61000-3-2:2006 |
• |
| EN61000-3-3:1995 +A1:2001, A2:2005 |
• |
EN60950-1:2001
(UL60950-equivalent) |
• |
| CSA C22.2, No. 60950 |
• |
| Product Warranty |
3 years |