Digi ConnectCore® i.MX51 / Wi-i.MX51

NRND

NXP/Freescale i.MX51 Cortex A8 SoM

Integrated secure wireless 802.11a/b/g/n Wi-Fi LAN
Powerful 2D/3D graphics and 720p video
Support for Embedded Linux, Microsoft Windows Compact 7, Windows CE 6.0, Android, and Yocto Project Linux
Industrial operating temperature

Overview Part Numbers & Accessories Specifications Resources Support

The network-enabled Digi ConnectCore Wi-i.MX51 is a highly integrated and future-proof system-on-module (SoM) solution based on the NXP/Freescale i.MX51 application processor with a high performance 600/800 MHz ARM Cortex-A8 core, powerful multimedia capabilities and a complete set of peripherals. It is the ideal choice for a broad range of target markets/applications including medical, digital signage, security/surveillance, access control, retail, industrial/building automation, transportation, traffic control, utilities/energy and more.

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Our software support services significantly improve time-to-market by providing experienced software design engineers who can provide programming support, code consultation, and trouble shooting for many of the current development environments including but not limited to: Python, Java, Android, C/C++, and C#. Learn more.

The Digi ConnectCore Wi-i.MX51 combines industry-leading performance, low power consumption and industrial operating temperature. Design integration is easy with key features like on-chip multimedia support, including multi-format 720P/30 fps video hardware decoding and 2D/3D graphics acceleration, dual-display interface, hardware encryption engine, 802.11abgn Wi-Fi interface, dual 10/100 Ethernet option and a comprehensive set of peripherals.

Modules in the ConnectCore i.MX embedded system-on-module family feature the design, development and administrative advantages offered by Digi Remote Manager. This robust cloud platform makes it easy to configure and manage deployments and integrate devices with virtually any application. Device manufacturers can build secure, highly scalable and cost-effective solutions that seamlessly tie assets to applications, regardless of location.

Complete and cost-efficient Digi JumpStart Kits for Microsoft Windows Embedded CE 6.0 R3, Microsoft Windows Embedded Compact 7, Timesys Linux, and Digi Embedded Linux allow immediate and professional embedded product development with dramatically reduced design risk and time-to-market. Additional support for Yocto Embedded Linux is also available for download.

Key Industries

Intelligent Lighting Controls Outpatient Care Devices

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User manuals & guides

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Digi was an enabling partner in the whole development process, and as a start-up company, partnering with companies like Digi is critical for our success.

James Paterson, Eykona co-founder

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Related Resources

Digi Embedded Linux 5 Feature Spec DOWNLOAD PDF

Digi Application Development Kit for Android™ Feature Spec DOWNLOAD PDF

Digi ConnectCore i.MX51 datasheet Digi ConnectCore i.MX51 datasheet VIEW PDF

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Digi JumpStart Kits
	Digi ConnectCore for i.MX51 JumpStart Kit for Windows Embedded CE 6.0R3 and Windows Embedded Compact 7, Download of 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen	CC-WMX51-CE	HOW TO BUY Contact Us
	Digi ConnectCore for i.MX51 Development Kit for Timesys LinuxLink, 7" WVGA LCD panel with touchscreen	CC-WMX51-LL	HOW TO BUY Contact Us

Specifications	Digi ConnectCore i.MX51	Digi ConnectCore Wi-i.MX51
Processor
Processor Model	NXP/Freescale® i.MX51
Speed Grades	600/800 MHz
Core Type	ARM® Cortex™-A8
Cache Memory	32 k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified)
Internal RAM	128 KB (secure/non-secure)
Vector Floating Point	•
NEON Media Acceleration	•
Memory
Flash	Up to 8 GB NAND flash
RAM	Up to 512 MB DDR2
Debug
Secure JTAG	•
ETM/ETB	•
Power Management
Power Modes	Run, Wait, Stop, Low-power screen refresh
Wake-up Events	GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach
Dynamic Voltage and Frequency Scaling	•
Backlight Drivers	3
Battery Management	•
Real Time Clock
Battery Backup	•
Security
Hardware encryption/decryption	AES, DES/3DES, RC4, C2 RSA, ECC MD5, SHA-1/224/256
Random Number Generator	•
Run Time Integrity Checker	•
Secure RAM (internal)	•
Fuse Box (e-Fuses)	64 Bits (application-specific use)
Physical Tamper Detectors	•
Timers
General Purpose Timer	32-bit up-counter with clock source selection 2 input capture channels 3 output compare channels, forced compare
Enhanced Periodic Interrupt Timer	32-bit down-counter with clock source selection Set-and-forget/free-running modes Precision interrupt generation
Watchdog	•
Connectivity
UART	Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support
IrDA Infrared	Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps)
CSPI	Master and slave mode Bit rate up to 25 Mbps (master)
eCSPI	Up to 2 eCSPI channels, master and slave mode Bit rates up to 66.5 Mbps (master)
I²C	Up to 3 channels, master/slave (7-/10-bit addressing) All: Standard (100 kbps) and fast (400 kbps) mode
SD/SDIO/MMC	Up to 4 ports, 1-/4-/8-bit modes MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode)
P-ATA	Up to 66 MB/s data rate PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5)
USB 2.0 High-Speed	Up to 3 USB 2.0 High-Speed Host ports (transceiver-less) Up to 1 USB 2.0 OTG port with PHY
1-Wire	•
ISO 7816 (SIM/Smart Card)	•
Keypad	8x8 keypad matrix
PWM	2
ADC (10-bit)	Up to 4 channels
GPIO	Up to 128 GPIOs
External Memory Bus	16-bit data/28-bit address in non-multiplexed address/data mode 16-bit or 32-bit data/28-bit address in multiplexed address/data mode
Multimedia
Camera	2 camera ports Bayer RGB, Full RGB, YUV 4:4:4, YUV 4:2:2, Gray scale, Generic data Parallel interface (up to 522 Mbps) or fast serial interface (up to 1.44 Gbps) Fast serial: Up to 6M pixels @ 15 fps (Bayer), Parallel: Up to 8M pixels @ 15 fps (Bayer) Window-of-interest selection, frame rate reduction, color depth reduction
Display	Primary and secondary display support / TV out (SD/HD) Up to 24-bit color depth, software contrast control Up to XGA (1024x768) @ 100 fps/720p (1280x720) @ 60 fps/1080i (1920x1080) @ 30 fps 3-/4-/5-wire serial interface, parallel, parallel bidirectional, DSI (4 lanes/4 channels)
Image Processing Unit	Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction
Video Processing Unit	MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG
GPU (2D/3D)	27 million triangles/sec, 166 million pixels/sec raw OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0
Touchscreen Interface (4-wire)	•
SPDIF (Tx)	•
I²S/AC97/SSI	Up to 3 channels
Ethernettd>
Physical Layer	10/100Base-T
Data Rates	10/100 Mbps, auto-sensing
Duplex Mode	Full or half duplex, auto-sensing
Power over Ethernet (802.3af)
Power Over Ethernet	Development board ready for 802.3af PoE application kit (sold separately)
Accelerometer
Three-Axis Accelerometer	±2g/±4g/±8g Three-Axis Low-g Freescale MA7455L
Wireless LAN
Standard	N/A	802.11a/b/g/n
Antenna Connectors	N/A	2 x U.FL
Dual Diversity	N/A	•
Frequency Bands	N/A	2.412 - 2.484 GHz
Frequency Bands	N/A	4.900 - 5.850 GHz
Data Rates	N/A	802.11b: 1, 2, 5.5, 11 Mbps
	N/A	802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
	N/A	802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps (MCS 0-7)
Modulation	N/A	DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM
802.11n Features	N/A	A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS
Transmit Power (±2 dBm)	N/A	802.11b: 17 dBm typical
	N/A	802.11g/n: 15 dBm typical
	N/A	802.11a/n: 12 dBm typical
Security	N/A	WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i
QoS	N/A	WMM, WMM-PS, 802.11e
Roaming Enhancements	N/A	802.11k/r
Extended Range (802.11n)	N/A	•
Radio Certifcations (Pending)	N/A	USA, Canada, EU, Japan
Power Requirements (w/o Ethernet and Wi-Fi)+
Typical¹	700 mA @ 3.75 V
Idle¹	200 mA @ 3.75 V
Module Population Options²
Processor Speed Grade	•
Memory (Flash/RAM)	•
Network Interfaces	Single 10/100 Ethernet, dual 10/100 Ethernet, 802.11a/b/g/n WLAN
Mechanical
Dimensions (L x W x H)	82 mm x 50 mm x 6.5 mm	82 mm x 50 mm x 8 mm
Module Connectors	2 x 180-pin board-to-board connectors, 0.8 mm pitch (Mating connector FCI P/N 61083-184409LF or similar)
Environmental
Operating Temperature	-40° C to +85° C (600 MHz) -20° C to +85° C (800 MHz)
Storage Temperature	-40° C up to +85° C (-40° F to +185° F)
Relative Humidity	5% to 90% (non-condensing)
Temperature/Climate Tests	IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40° C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85° C), IEC 60068-2-78 (Damp heat steady state: 16h with +40° C and 93% rH)
Shock/Vibration Tests	IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea
Regulatory Approvals (Pending)
FCC Part 15 Class B	•
FCC Part 15 Sub C Section 15.247	•
IC RSS-210 Issue 5 Section 6.2.2(o)	•
EN55022:2006 Class B	•
ICES-003, Class B	•
VCCI, Class B	•
EN55024:1998 +A1:2001, A2:2003	•
EN61000-3-2:2006	•
EN61000-3-3:1995 +A1:2001, A2:2005	•
EN60950-1:2001 (UL60950-equivalent)	•
CSA C22.2, No. 60950	•
Warranty
Product Warranty	3 years

¹ Baseline power consumption based on standard use case without WLAN and Ethernet. See Hardware Reference Manual for more detailed information.
² Contact your local distributor or Digi sales office for details.
• Module feature

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